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Space Product Assembly

COM DEV International has recently invested in dedicated clean room facilities and associated equipment to professionally assemble components for reliable operation in space. Some of the equipment available is listed in the table below. 

Assembly and Test

Class 10,000 SPACE clean room area with dedicated Space Stores, restricted access to trained staff and secure storage of paper records, excess parts, glue coupons, bond pull coupons etc.

 

Bonding

Fully Automatic, Semi Automatic and Manual Bonders

  • For gold or aluminium
  • Using wire or ribbon.
  • For connections to terminations or more complex assemblies.

 

Bond Pull test

Dage Microtester

  • For standard width wires or ribbons Bonded or welded to circuit patterns
  • Non-destructive testing to MIL-STD-883D Method 2023
  • Destructive testing to MIL-STD-883D Method 2011

 

Soldering

Void Free using SRO-702 ATV chamber to achieve void-free solder joints for optimum heat transfer from high power MMIC devices. Can also be used for flux-free solder assembly of large-area components, such as substrate and heat spreader attachment to carriers.

Also manual soldering with solder iron and/or hotplate and Reflow Solder Equipment is available.

 

Sealing

Pyramid projection welding – any standard “can” package

  • Slee seam sealer – any standard “can” package
  • Epoxy seal – using preform gaskets
  • Indium wire seal

 

Seal Test

 

  • PIND Tester for vibrating projection weld packages after sealing
    Testing to MIL-STD-883E Method 2020.7
  • Gross Leak Testing using Trioteck Tester with 3M FC-40 to MIL-STD-202 Method 112
  • Fine Leak testing using a Pfeiffer QualyTest HLT270 to MIL-STD-883C Method 1014.6
  • Post-seal units can be either gross leak or fine leak tested with helium
Cleaning

 

  • Plasma cleaning,
  • Ultrasonic degreaser
Inspection
  • Mitutoyo Crysta Apex C776 CMM for dimension checks, flatness, finish and tolerance checks Verniers, micrometers, microscopes. High magnification photography with record function.
  • Connector Checks – SMA interfaces, centre contact retention, engagement and separation force etc.
COM DEV International, Lochend Industrial Estate, Newbridge, Edinburgh, EH28 8PL, Scotland
Tel: 0131 333 2000 | Fax: 0131 333 3607 | COM DEV Europe Limited Registered England and Wales Company Number: 1863723