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Sub Contract Manufacture
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COM DEV International has a broad range of expertise and experience with different manufacturing techniques, which enables us to offer a sub-contract manufacturing service.  Using a combination of in-house skills and equipment and a network of local external specialist companies, we are able to offer a managed build-to-print (B2P) service to customers in market areas as diverse as military, telecommunications and security.

In-house facilities

  • Automatic bonding of various MMICs, PIN Diodes, Hybrid, Beam Lead Chips using thermo-sonic and thermo-compression bonders on gold and aluminium wires and tape to 1 thou diameter
  • Semi-automatic Pick and Place and IR Reflow techniques
  • In-house machining CNC linked to 3D CAD
  • SMT and TH Assembly
  • Vibration, Humidity and Temperature testing
  • MRSI

Please contact us to discuss any potential opportunities you may have.

Please also refer to the "Manufacturing" page in the "Capabilities" section of the site for more details.

COM DEV International, Lochend Industrial Estate, Newbridge, Edinburgh, EH28 8PL, Scotland
Tel: 0131 333 2000 | Fax: 0131 333 3607 | COM DEV Europe Limited Registered England and Wales Company Number: 1863723