MESL Microwave has a broad range of expertise and experience with different manufacturing techniques, which enables us to offer a sub-contract manufacturing service.  Using a combination of in-house skills and equipment and a network of local external specialist companies, we are able to offer a managed build-to-print (B2P) service to customers in market areas as diverse as military, telecommunications and security.

In-house facilities

• Automatic bonding of various MMICs, PIN Diodes, Hybrid, Beam Lead Chips using thermo-sonic and thermo-compression bonders on gold and aluminium wires and tape to 1 thou diameter
• Semi-automatic Pick and Place and IR Reflow techniques
• In-house machining CNC linked to 3D CAD
• SMT and TH Assembly
• Vibration, Humidity and Temperature testing
• MRSI

Please contact us to discuss any potential opportunities you may have.

Please also refer to the "Manufacturing" page in the "Capabilities" section of the site for more details.